COMPUPLAST
Flat Die

The VEL™, Flat Die module is used for the analysis and design of the types of dies that are typically used in flat film and sheet production or extrusion coating applications. Based on the Control Volume Method (CVM) of mathematical analysis, this program can provide the user with an accurate prediction of the expected die performance. From simple “T-Slot” dies to complex “Coat-hanger” designs, the Flat Die module has the versatility to accommodate almost anything a designer can come up with. The user-friendly, intuitive interface and CVM solution technique allows the user to optimize designs quickly and easily.

The VEL™, Flat Die module has been developed with the extrusion process engineer in mind. Many world class extrusion die manufacturers use the Flat Die module as a part of their daily design procedures. Many processors and technical service personnel use this module to study and analyze the effect of resin changes on their process. In addition to flat dies, this module has also been successfully applied to the design of side fed, annular dies for profile, tubing, pipe, blow molding and pelletizing applications. In fact, any extrusion application requiring a controlled material distribution can benefit from the Flat Die module. Combine it with the Multi-Layer module and you have all the tools you need to analyze and design coextrusion dies for a wide range of applications.

The VEL™, Flat Die module features:
- improved graphical design interface
- complete die analysis
- incorporates chamber and die lip effects
- fast calculations
- improved image/results saving capability
- improved Material Database interface